BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point
BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point
1. Lead-free Solder Paste is a high-performance, no-clean soldering solution designed for precision electronics assembly and repair. Ideal for BGA... Read more
£16.31
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